发明名称 EPOXY RESIN COMPOSITION, AND PREPREG AND COPPER CLAD LAMINATE MADE THEREFROM
摘要 The present invention relates to a resin composition, particularly an epoxy resin composition, and a prepreg and a copper clad laminate made therefrom. The epoxy resin of epoxy resin composition according to the present invention is cured with ester compound and flexible amine curing agent, thus the resin composition can have high glass transition temperature and good toughness, and meanwhile maintain excellent dielectric properties. When the epoxy resin composition of the present invention is used for prepreg and copper clad laminate, it can show excellent dielectric properties, high glass transition temperature and good impact toughness.
申请公布号 WO2016019595(A1) 申请公布日期 2016.02.11
申请号 WO2014CN84303 申请日期 2014.08.13
申请人 SHENGYI TECHNOLOGY CO., LTD. 发明人 XIN, YUJUN;CHEN, YONG;ZENG, XIANPING;XU, YONGJING
分类号 C08L63/00;C08L71/02 主分类号 C08L63/00
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