发明名称 LED WITH HIGH THERMAL CONDUCTIVITY PARTICLES IN PHOSPHOR CONVERSION LAYER
摘要 In one embodiment, a solid cylindrical tablet is pre-formed for a reflective cup containing an LED die, such as a blue LED die. The tablet comprises uniformly-mixed phosphor particles and transparent/translucent particles of a high TC material, such as quartz, in a hardened silicone binder, where the index of refraction of the high TC material is matched to that of the silicone to minimize internal reflection. Tablets can be made virtually identical in composition and size. The bulk of the tablet will be the high TC material. After the tablet is placed in the cup, the LED module is heated, preferably in a vacuum, to melt the silicone so that the mixture flows around the LED die and fills the voids to encapsulate the LED die. The silicone is then cooled to harden.
申请公布号 US2016043285(A1) 申请公布日期 2016.02.11
申请号 US201414782774 申请日期 2014.04.02
申请人 KONINKLIJKE PHILIPS N.V. 发明人 Basin Grigoriy;Fouksman Mikhail
分类号 H01L33/50;H01L33/64;H01L33/52;H01L33/60;H01L25/075 主分类号 H01L33/50
代理机构 代理人
主权项 1. A method of fabricating a light emitting diode (LED) module comprising: providing a reflective cup containing at least one LED die; positioning a solid piece in the cup and over the LED die, the solid piece comprising: a binder having a first index of refraction and a first thermal conductivity;wavelength conversion particles mixed in the binder that convert first light emitted by the LED die to second light of a different wavelength; andhigh thermal conductivity particles mixed in the binder, the high thermal conductivity particles having a second index of refraction substantially equal to the first index of refraction and having a second thermal conductivity greater than the first thermal conductivity; after the solid piece is positioned, softening the piece to flow the wavelength conversion particles, the high thermal conductivity particles, and the binder around the LED die to encapsulate the LED die; and hardening the softened piece after encapsulation of the LED die.
地址 Eindhoven NL