发明名称 |
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A wiring substrate includes an insulating layer, a connection pad buried in the insulating layer in a state that an upper surface of the connection pad is exposed from an upper surface of the insulating layer and a lower surface and at least a part of a side surface of the connection pad contact the insulating layer, and a concave level difference portion formed in the insulating layer around an outer periphery part of the connection pad, wherein an upper surface of the connection pad and an upper surface of the insulating layer are arranged at a same height. |
申请公布号 |
US2016044792(A1) |
申请公布日期 |
2016.02.11 |
申请号 |
US201514922972 |
申请日期 |
2015.10.26 |
申请人 |
Shinko Electric Industries Co., Ltd. |
发明人 |
KANEKO Kentaro;Omiya Toshimitsu;Kodani Kotaro;Nakamura Junichi;Kobayashi Kazuhiro |
分类号 |
H05K3/18;H05K3/46;C25D5/02;H05K3/00 |
主分类号 |
H05K3/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Nagano-shi JP |