| 发明名称 |
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
| 摘要 |
There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer. |
| 申请公布号 |
US2016044788(A1) |
申请公布日期 |
2016.02.11 |
| 申请号 |
US201514794632 |
申请日期 |
2015.07.08 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK Jung Hyun;BAEK Yong Ho;CHOI Jae Hoon |
| 分类号 |
H05K1/18;H05K3/42;H05K3/46;H05K3/30;H05K1/02;H05K1/11 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board comprising:
a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer. |
| 地址 |
Suwon-Si KR |
