ELECTRONIC PACKAGE WITH NARROW-FACTOR VIA INCLUDING FINISH LAYER

摘要

This disclosure relates generally to an electronic package and methods that include an electrically conductive pad, a package insulator layer including a substantially non-conductive material, the package insulator layer being substantially planar, and a via. The via may be formed within the package insulator layer and electrically coupled to the electrically conductive pad. The via may include a conductor extending vertically through at least part of the package insulator layer and having a first end proximate the electrically conductive pad and a second end opposite the first end and a finish layer secured to the second end of the conductor, the finish layer including a gold compound.

主权项

1. An electronic package, comprising:
an electrically conductive pad; a package insulator layer including a substantially non-conductive material, the package insulator layer being substantially planar; and a via, formed within the package insulator layer, electrically coupled to the electrically conductive pad, the via comprising: a conductor extending vertically through at least part of the package insulator layer and having a first end proximate the electrically conductive pad and a second end opposite the first end; and a finish layer secured to the second end of the conductor, the finish layer including a palladium layer in contact with the second end of the conductor and a gold compound layer in contact with the palladium layer.