| 发明名称 |
ROLL-TO-ROLL ELECTROLESS PLATING SYSTEM FOR CONTROLLED SUBSTRATE DEPTH |
| 摘要 |
A roll-to-roll electroless plating system for controlled substrate depth includes electroless plating solution disposed within an electroless plating bath, a conveyor system configured to convey a roll-to-roll substrate material through the electroless plating solution, a first depth setting roller disposed at an entry location of the roll-to-roll substrate material to the electroless plating solution, and a second depth setting roller disposed at an exit location of the roll-to-roll substrate material from the electroless plating solution. A diameter of the first and the second depth setting rollers is selected to dispose the roll-to-roll substrate material at a predetermined depth of the electroless plating solution. |
| 申请公布号 |
US2016040290(A1) |
申请公布日期 |
2016.02.11 |
| 申请号 |
US201414495373 |
申请日期 |
2014.09.24 |
| 申请人 |
Uni-Pixel Displays, Inc. |
发明人 |
Chyan Yieu;Jin Danliang;O'Neil John-Paul |
| 分类号 |
C23C18/16 |
主分类号 |
C23C18/16 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A roll-to-roll electroless plating system for controlled substrate depth comprising:
electroless plating solution disposed within an electroless plating bath; a conveyor system configured to convey a roll-to-roll substrate material through the electroless plating solution; a first depth setting roller disposed at an entry location of the roll-to-roll substrate material to the electroless plating solution; a second depth setting roller disposed at an exit location of the roll-to-roll substrate material from the electroless plating solution, wherein a diameter of the first and the second depth setting rollers is selected to dispose the roll-to-roll substrate material at a predetermined depth of the electroless plating solution. |
| 地址 |
The Woodlands TX US |
