发明名称 AIR COOLING SYSTEMS AND METHODS FOR MICROFLUIDIC DEVICES
摘要 Systems and methods for air cooling a microfluidic device using confinement channels to isolate cooling air from exposed liquids are disclosed. The systems and methods may also thermally condition the cooling airflow for improved robustness of the microfluidic device. In one embodiment, the air cooling system includes a split-level cooling manifold including an inlet duct that directs cooling air to a microfluidic device and an outlet duct that directs air heated by the microfluidic device away from the microfluidic device. The temperature of cooling air may be measured. The cooling air may be preheated to a temperature that is higher than an expected ambient temperature. The temperature of the cooling air after being heated by a microfluidic device may be measured.
申请公布号 US2016038945(A1) 申请公布日期 2016.02.11
申请号 US201514923058 申请日期 2015.10.26
申请人 Canon U.S. Life Sciences, Inc. 发明人 Coursey Johnathan S.;Hasson Kenton C.;Lane Ben;Schneider Eric
分类号 B01L7/00;F28F9/02;C12P19/34 主分类号 B01L7/00
代理机构 代理人
主权项 1. A bi-level cooling manifold for cooling a microfluidic device having one or more microfluidic channels, one or more inlet ports, one or more outlet ports and one or more heat sinks, the cooling manifold comprising: a first duct including: an upper confinement channel; anda vertical channel connected to the upper confinement channel; a second duct including: a lower confinement channel, wherein at least a portion of the lower confinement channel is underneath the upper confinement channel; andan opening; wherein the cooling manifold is configured to isolate airflow in the first and second ducts from the one or more inlet ports of the microfluidic device.
地址 Rockville MD US