发明名称 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 A printed wiring board includes an insulating layer, a first conductor layer embedded into first surface of the insulating layer and including multiple wirings such that the wirings include connecting portions positioned to connect an electronic component, respectively, a second conductor layer projecting from second surface of the insulating layer on the opposite side, a solder resist layer formed on the first surface of the insulating layer such that the solder resist layer is covering the first conductor layer and has an opening structure exposing the connecting portions of the wirings, and multiple metal posts formed on the connecting portions respectively such that each of the metal posts has a width which is larger than a width of a respective one of the wirings having the connecting portions. The wirings are formed such that the connecting portions are positioned side by side on every other adjacent one of the wirings.
申请公布号 US2016043027(A1) 申请公布日期 2016.02.11
申请号 US201514820963 申请日期 2015.08.07
申请人 IBIDEN CO., LTD. 发明人 INAGAKI Yasushi;NODA Kota
分类号 H01L23/498;H05K3/40;H05K3/46 主分类号 H01L23/498
代理机构 代理人
主权项 1. A printed wiring board, comprising: a resin insulating layer; a first conductor layer embedded into a first surface of the resin insulating layer and comprising a plurality of wirings such that the plurality of wirings includes a plurality of connecting portions positioned to connect an electronic component, respectively; a second conductor layer projecting from a second surface of the resin insulating layer on an opposite side with respect to the first surface of the resin insulating layer; a solder resist layer formed on the first surface of the resin insulating layer such that the solder resist layer is covering the first conductor layer and has an opening structure exposing the connecting portions of the wirings; and a plurality of metal posts formed on the plurality of connecting portions respectively such that each of the metal posts has a width which is larger than a width of a respective one of the wirings having the connecting portions, wherein the plurality of wirings is formed such that the connecting portions are positioned side by side on every other adjacent one of the wirings.
地址 Ogaki-shi JP