| 发明名称 |
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
In one embodiment, a semiconductor manufacturing apparatus includes a container configured to contain a wafer, and a supporter configured to support the wafer in the container. The apparatus further includes a plasma generator including a plasma tube, and configured to form a film on the wafer by generating plasma in the container with the plasma tube during a first period and during a second period after the first period. The apparatus further includes a controller configured to set a distance between the plasma tube and the wafer to be a first distance during the first period, and set the distance to be a second distance longer than the first distance during the second period. |
| 申请公布号 |
US2016042944(A1) |
申请公布日期 |
2016.02.11 |
| 申请号 |
US201514624829 |
申请日期 |
2015.02.18 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
SUGURO Kyoichi |
| 分类号 |
H01L21/02;H01J37/32 |
主分类号 |
H01L21/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor manufacturing apparatus comprising:
a container configured to contain a wafer; a supporter configured to support the wafer in the container; a plasma generator including a plasma tube, and configured to form a film on the wafer by generating plasma in the container with the plasma tube during a first period and during a second period after the first period; and a controller configured to set a distance between the plasma tube and the wafer to be a first distance during the first period, and set the distance to be a second distance longer than the first distance during the second period. |
| 地址 |
Tokyo JP |
