发明名称 CONDUCTIVE FILM SUBSTRATE, TRANSPARENT CONDUCTIVE FILM, AND METHOD FOR PRODUCING TRANSPARENT CONDUCTIVE FILM
摘要 Provided is a transparent conductive film including a transparent electrode layer composed of a patterned thin metal wire on at least one surface of a transparent film substrate. The line width of the wire is 5 μm or less. The wire includes a first metal layer and a second metal layer that is in contact with the first metal layer, in this order from a transparent film substrate side. Both of the first and second metal layers contain copper in an amount of 90% by weight or more. The total film thickness of the first and second metal layers is 150 to 1000 nm. The diffraction angle 2θ of the (111) plane of the second metal layer is less than 43.400° as measured using a CuKα ray as an X-ray source, and the first metal layer has crystal properties different from those of the second metal layer.
申请公布号 US2016044778(A1) 申请公布日期 2016.02.11
申请号 US201414780529 申请日期 2014.03.03
申请人 KANEKA CORPORATION 发明人 Irie Tooru;Fujimoto Takahisa;Kuchiyama Takashi;Hayakawa Hironori;Omoto Shinya;Yamamoto Kenji
分类号 H05K1/02;H05K3/22;H05K3/06;H05K3/00;H05K1/03;H05K1/09 主分类号 H05K1/02
代理机构 代理人
主权项 1. A transparent conductive film comprising: a transparent film substrate; and a transparent electrode layer composed of a patterned thin metal wire on at least one surface of the transparent film substrate, wherein the thin metal wire has a line width of 5 μm or less, the thin metal wire includes a first metal layer and a second metal layer in this order from a transparent film substrate side, the second metal layer being in contact with the first metal layer, the first metal layer and the second metal layer each contain copper in an amount of 90% by weight or more, a total thickness of the first metal layer and the second metal layer is 150 to 1000 nm, a diffraction angle 2θ of a (111) plane in the second metal layer is less than 43.400° as measured using a CuKα ray as an X-ray source, and the first metal layer has crystal properties different from those of the second metal layer.
地址 Osaka JP
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