| 发明名称 |
COMPOSITION FOR FORMING ADHESIVE LAYER OF DICING FILM, AND DICING FILM |
| 摘要 |
There are provided a composition for forming an adhesive layer of a dicing film including: a silicon compound oil including at least one reactive functional group; an adhesive binder; and a photoinitiator, wherein a weight ratio of the silicon compound oil including at least one reactive functional group to the adhesive binder is 0.01% to 4.5%, a dicing film including an adhesive layer including the composition, a dicing die bonding film including the dicing film, and a method for dicing a semiconductor wafer using the dicing die bonding film. |
| 申请公布号 |
US2016040042(A1) |
申请公布日期 |
2016.02.11 |
| 申请号 |
US201414781507 |
申请日期 |
2014.12.12 |
| 申请人 |
LG CHEM, LTD. |
发明人 |
KIM Young Kook;KIM Se Ra;KIM Hee Jung;JO Jung Ho;LEE Kwang Joo;KIM Jung Hak;NAM Seung Hee |
| 分类号 |
C09J11/08;H01L21/26;H01L21/78;C09J133/00;C09J7/02 |
主分类号 |
C09J11/08 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A composition for forming an adhesive layer of a dicing film, comprising:
a silicon compound oil comprising at least one reactive functional group; an adhesive binder; and a photoinitiator, wherein a weight ratio of the silicon compound oil comprising at least one reactive functional group to the adhesive binder is 0.01% to 4.5%. |
| 地址 |
Seoul KR |
