| 摘要 |
The curable composition for encapsulating an optical semiconductor comprises (A) a linear polyfluoro compound, (B) a cyclic organosiloxane having a SiH group and a fluorine-containing organic group, and/or an organo hydrogen siloxane having a SiH group and a fluorine-containing organic group, (C) a platinum group metal catalyst, (D) a cyclic organosiloxane having a SiH group, a fluorine-containing organic group and an epoxy group, and (E) a cyclic organopolysiloxane having a monovalent unsaturated hydrocarbon group and a fluorine-containing organic group, and a hardness of the cured product obtained by curing is 30 to 80 by Type A durometer regulated by JIS K6253-3. The present invention is to provide a curable composition for encapsulating an optical semiconductor which gives a cured product excellent in impact resistance and adhesiveness, and an optical semiconductor apparatus in which an optical semiconductor device is encapsulated by a cured product obtained by curing the curable composition for encapsulating an optical semiconductor. |
