| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of preparing a resin composition, a resin composition, and a semiconductor device, capable of obtaining a resin composition excellent in fluidity and curing characteristics when sealing a semiconductor element. <P>SOLUTION: A method of the present invention is a method for preparing a resin composition that seals a semiconductor chip 120 installed on a circuit board 110 and fills a gap between the circuit board 110 and the semiconductor chip 120 as well at the time of sealing. The method includes a crushing step for crushing a row material containing a powder material of a curing resin and a powder material of a first inorganic filler material, a surface treatment step for performing surface treatment on a powder material of a second inorganic filler material, a mixing step for mixing the row material after crushing with the second inorganic filler material whose surface has been treated, and a kneading step for kneading a mixture having been mixed in the mixing step. <P>COPYRIGHT: (C)2013,JPO&INPIT |
