半導体装置,申请号JP20120222994-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	半導体装置
摘要
申请公布号	JP5858895(B2)	申请公布日期	2016.02.10
申请号	JP20120222994	申请日期	2012.10.05
申请人	カルソニックカンセイ株式会社	发明人	安在岳士;岡崎文洋
分类号	H01L25/07;H01L23/48;H01L25/18;H02M7/48	主分类号	H01L25/07
代理机构		代理人
主权项
地址

您可能感兴趣的专利

COMBUSTIVEL ALTERNATIVO PARA USO EM FORNOS INDUSTRIAIS

Buffer circuit with load sensitive transition control

Water-in-oil-type cosmetic

Cable guiding apparatus for industrial robot

Blowing agents for polyurethane foam

Method and a device for fault location in the event of a fault on a power transmission line

Treatment of polyacrylamide gel particles with amidase to reduce residual acrylamide content thereof

Polyisocyanate prepolymer compositions and the use thereof in the preparation of polyurethanes

Process for producing crosslinked polymer particles

Process for producing 2-methyl-1,4-naphthoquinone

PERFEZIONAMENTO IN MACCHINA ETICHETTATRICE PER ETICHETTE AUTOADESIVE

PATRONENZUFUEHREINRICHTUNG FUER EINE AUTOMATISCHE FEUERWAFFE

MAQUINA INJETORA

CORTADOR SIMPLIFICADO PARA FILMES

GRAVADOR MULTI-CANAIS DE FITAS CASSETTE

MODULO PARA BICA CONCENTRADORA DE MINERIOS

INPUT/OUTPUT DEVICE FOR ELEVATOR

PHASE SYNTHESIS TYPE SPACE DIVERSITY RECEIVER

RECEPTION PICTURE OUTPUT SYSTEM FOR FACSIMILE EQUIPMENT