| 摘要 |
A package for an optical semiconductor element is provided. The package includes: a stem body (10) having a sealing hole therein; and a lead pin (12) having a glass sealing portion which is sealed with sealing glass (13) in the sealing hole. Characteristic impedance of the glass sealing portion is adjusted to a given value. The characteristic impedance Zo is given by: Zo = (138/ Er 1/2 )×log( D / d ), where a hole diameter of the sealing hole is D , a wire diameter of the lead pin (12) is d , and a dielectric constant of the sealing glass (13) is Er , and the dielectric constant Er of the sealing glass is set by controlling an amount of bubble contained in the sealing glass (13). |
