| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a new composite lead frame structure for a multi-chip intended to eliminate advanced processing required in advance when bonding leads of two types of support substrates, a metallic substrate and an organic material substrate, and a variety of inconvenience, in a composite lead frame structure having semiconductor chips mounted above and below the central portion of the lead frame. <P>SOLUTION: A multi-chip composite lead frame 1 for mounting mutually different semiconductor chips above and below the central portion of the lead frame at least includes: an inner lead frame group 11 disposed toward the one semiconductor chip to deal with at least one semiconductor chip; an inner lead frame group 12 disposed toward another semiconductor chip to deal with the other semiconductor chip; and a semiconductor chip island composed of an insulative resin sheet 14 fixed to and supported by the end portion of any one of the inner lead frame groups. <P>COPYRIGHT: (C)2013,JPO&INPIT |
