| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive for sealing a semiconductor which improves connectivity between a semiconductor chip and a substrate and connectivity between two semiconductor chips, and can secure storage stability. <P>SOLUTION: In a semiconductor device 100 which has each of connection units 15 and 32 of a semiconductor chip 10 and a wiring circuit board 20 electrically connected to each other, or a semiconductor device which has each of connection units of a plurality of semiconductor chips electrically connected to each other, an adhesive 40 for sealing for a semiconductor which seals the connection unit contains (a) a primary or secondary nitrogen atom-containing compound, (b) an ester, and (c) an epoxy resin. <P>COPYRIGHT: (C)2013,JPO&INPIT |
