| 摘要 |
PURPOSE:To decrease the effects of shock at the time of cutting and to improve moisture resistance and reliability, by setting the width of a linking part to be a specified multiple of the thickness of the linking part, and making the surface area of the W part, which is linked to the linking part, to be a specified percentage of the surface area of a resin sealed part. CONSTITUTION:Lead parts 6 and 7 are arranged around a die pad part 5, on which an IC element is mounted. The die pad part 5 is coupled to an outer rail 1 of a die-pad supporting part 2. The width of a linking part 3 of the die- pad supporting part 2 is made to be 0.5-1 time the thickness of the linking part. The part of the supporting part, which is linked to the linking part, is made to be an approximately a W shape. The surface area S1 of the W shaped part 4 is made to be 10% or more of the surface area S2 of the resin sealed part of a lead frame. |
