发明名称 セラミック電子部品
摘要 A ceramic electronic component includes two electronic-component main bodies and two metal terminals. Each of the metal terminals includes a base, ribs on left and right sides of the base, and a mounting portion below the base. The base includes two bonding portions to be bonded to respective external electrodes of the two electronic-component main bodies and cut-out portions each having a closed shape and being disposed below the respective bonding portions. The ribs are bent from the left and right sides of the base in the width direction toward the electronic-component main body. The ribs extend from the top of the base in the height direction to the vicinity of the mounting-side major surface of the mounting-side electronic-component main body and do not reach the mounting portion. The mounting portion is bent from the bottom of the base toward the electronic-component main body.
申请公布号 JP5857847(B2) 申请公布日期 2016.02.10
申请号 JP20120078669 申请日期 2012.03.30
申请人 株式会社村田製作所 发明人 板垣 要司;小谷 純
分类号 H01G4/228;H01G2/04;H01G4/232;H01G4/30 主分类号 H01G4/228
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