Protective layering process for circuit boards

摘要

A polymer layering process that encapsulates and protects electronics components with complex and imprecise geometries. The protective layering process provides a combination of a flexible mold and/or a rigid mold that apply close-forming, encapsulating the polymer layers to the electronic components and precision assemblies. Polymer layer protective jackets are shaped to as-populated circuit boards and assemblies, providing tightly fit barriers with fine resolution accommodating imprecise geometries. The protective jackets can be formed in rigid, semi-rigid, or highly flexible polymer films, to protect the circuitry from the elements, CTE mismatches, shock and vibration loads and extreme g-forces.

主权项

1. A method for encapsulating a populated circuit board assembly having an imprecise three-dimensional geometry, with at least one protective layer that is tightly fit to the imprecise geometry of the populated circuit board assembly, the method comprising:
making a mold of the populated circuit board assembly; using the mold to encapsulate the populated circuit board assembly with said at least one protective layer; wherein making the mold includes:
scanning the populated circuit board assembly to create a surface file of the populated circuit board assembly;enlarging the surface file to accommodate for variations of the mold and said at least one protective layer;using the enlarged surface file to create a positive mold; wherein encapsulating the populated circuit board assembly with said at least one protective layer includes:
using the positive mold to create a multi-layer compliant mold;heating a first protective layer of said at least one protective layer;drawing the heated first protective layer within the compliant mold, in order to pre-form an envelope with a substantially precise representation of the populated circuit board assembly;pressing the positive mold against the pre-formed envelope within the compliant mold to form the envelope;releasing the formed envelope from the positive mold and the compliant mold; andplacing the formed envelope onto the populated circuit board assembly to be encapsulated.