发明名称 Semiconductor device including a reservoir capacitor
摘要 A semiconductor device includes: a Through Silicon Via (TSV) region extending in a first direction and crossing a center portion of a semiconductor device; a plurality of cell regions disposed at both sides of the TSV region in a second direction crossing the first direction; a plurality of peripheral circuit regions each disposed between the TSV region and a corresponding cell region or between two neighboring cell regions in the first direction; a plurality of test pad regions each disposed at an edge portion of the semiconductor device and having a plurality of test pads, wherein the plurality of test pad regions encloses the cell regions, the peripheral circuit regions, and the TSV region; and a reservoir capacitor disposed below corresponding test pads in a test pad regions.
申请公布号 US9257434(B2) 申请公布日期 2016.02.09
申请号 US201414520105 申请日期 2014.10.21
申请人 SK HYNIX INC. 发明人 Yang Seung Yeub;Kim Jin Ho
分类号 H01L23/48;H01L27/10;H01L27/11;H01L31/00;H01L27/108;H01L23/522;G01R31/28;H01L21/66;H01L27/115 主分类号 H01L23/48
代理机构 代理人
主权项 1. A semiconductor device comprising: a Through Silicon Via (TSV) region extending in a first direction and crossing a center portion of the semiconductor device; a plurality of cell regions disposed at both sides of the TSV region in a second direction crossing the first direction; a plurality of peripheral circuit regions, each disposed between the TSV region and a corresponding cell region or between two neighboring cell regions in the first direction; a plurality of test pad regions, each disposed at an edge portion of the semiconductor device and including a plurality of test pads, the plurality of test pad regions enclosing the cell regions, the peripheral circuit regions, and the TSV region; and a reservoir capacitor disposed below corresponding test pads in the test pad regions.
地址 Icheon KR