发明名称 |
Semiconductor device including a reservoir capacitor |
摘要 |
A semiconductor device includes: a Through Silicon Via (TSV) region extending in a first direction and crossing a center portion of a semiconductor device; a plurality of cell regions disposed at both sides of the TSV region in a second direction crossing the first direction; a plurality of peripheral circuit regions each disposed between the TSV region and a corresponding cell region or between two neighboring cell regions in the first direction; a plurality of test pad regions each disposed at an edge portion of the semiconductor device and having a plurality of test pads, wherein the plurality of test pad regions encloses the cell regions, the peripheral circuit regions, and the TSV region; and a reservoir capacitor disposed below corresponding test pads in a test pad regions. |
申请公布号 |
US9257434(B2) |
申请公布日期 |
2016.02.09 |
申请号 |
US201414520105 |
申请日期 |
2014.10.21 |
申请人 |
SK HYNIX INC. |
发明人 |
Yang Seung Yeub;Kim Jin Ho |
分类号 |
H01L23/48;H01L27/10;H01L27/11;H01L31/00;H01L27/108;H01L23/522;G01R31/28;H01L21/66;H01L27/115 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device comprising:
a Through Silicon Via (TSV) region extending in a first direction and crossing a center portion of the semiconductor device; a plurality of cell regions disposed at both sides of the TSV region in a second direction crossing the first direction; a plurality of peripheral circuit regions, each disposed between the TSV region and a corresponding cell region or between two neighboring cell regions in the first direction; a plurality of test pad regions, each disposed at an edge portion of the semiconductor device and including a plurality of test pads, the plurality of test pad regions enclosing the cell regions, the peripheral circuit regions, and the TSV region; and a reservoir capacitor disposed below corresponding test pads in the test pad regions. |
地址 |
Icheon KR |