| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a composition for producing a thermosetting resin, a cured product thereof, a prepreg and a prepreg laminate containing the cured product, and a metal clad laminate and a printed wiring board prepared using the prepreg or prepreg laminate. <P>SOLUTION: The composition for producing a thermosetting resin contains an aromatic polyester amide copolymer having at least one of an amino-terminal group and a hydroxyl-terminal group, an epoxy resin, and, selectively, a bismaleimide. <P>COPYRIGHT: (C)2012,JPO&INPIT |
