发明名称 Nitride light-emitting diode element and method of manufacturing same
摘要 A nitride LED having improved light extraction efficiency and/or axial luminous intensity is provided. The nitride LED contains a nitride semiconductor substrate having, on a front face thereof, a light-emitting structure made of a nitride semiconductor, wherein a roughened region is provided on a back face of the substrate, the roughened region has a plurality of protrusions, each of the plurality of protrusions has a top point or top plane and has a horizontal cross-section which is circular, except in areas where the protrusion is tangent to other neighboring protrusions, and which has a surface area that decreases on approaching the top point or top plane, the plurality of protrusions are arranged such that any one protrusion is in contact with six other protrusions, and light generated in the light-emitting structure is output to the exterior through the roughened region.
申请公布号 US9257595(B2) 申请公布日期 2016.02.09
申请号 US201314054079 申请日期 2013.10.15
申请人 MITSUBISHI CHEMICAL CORPORATION 发明人 Haruta Yuki;Katsumoto Tadahiro;Shimoyama Kenji
分类号 H01L33/00;H01L33/22;H01L33/32 主分类号 H01L33/00
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A method of manufacturing a nitride LED, comprising a first step of providing a roughened region on a back face of a nitride semiconductor substrate having, on a front face thereof, a light-emitting structure made of a nitride semiconductor, wherein the roughened region has a plurality of protrusions, each of the plurality of protrusions has a top point or top plane and has a horizontal cross-section which is circular, except in areas where the protrusion is tangent to other neighboring protrusions, and which has a surface area that decreases on approaching the top point or top plane, the plurality of protrusions are arranged such that any one protrusion is in contact with six other protrusions, and in the first step, the roughened region is formed by dry etching treatment of the substrate.
地址 Chiyoda-ku JP