发明名称 Methods of forming a Field Effect Transistor, including forming a region providing enhanced oxidation
摘要 Methods of forming a Field Effect Transistor (FET) are provided. The methods may include forming a region that provides enhanced oxidation under a fin-shaped FET (FinFET) body.
申请公布号 US9257327(B2) 申请公布日期 2016.02.09
申请号 US201313859482 申请日期 2013.04.09
申请人 Samsung Electronics Co., Ltd. 发明人 Rodder Mark S.;Seo Kang-ill
分类号 H01L21/76;H01L21/762;H01L29/66;H01L27/088;H01L29/78;H01L21/8238;H01L21/8234;H01L29/786;H01L27/092 主分类号 H01L21/76
代理机构 Myers Bigel Sibley & Sajovec, PA 代理人 Myers Bigel Sibley & Sajovec, PA
主权项 1. A method of forming a Field Effect Transistor (FET), comprising: implanting ions into a substrate comprising a fin-shaped FET (FinFET) body protruding from the substrate, such that the FinFET body overlaps a portion of an implanted region of the ions, wherein the FinFET body comprises opposite first and second sidewalls; recessing the substrate to remove portions of the implanted region exposed by the FinFET body and such that the FinFET body overlaps a remaining portion of the implanted region; forming an isolation layer on the substrate and on sidewalls of the remaining portion of the implanted region; and oxidizing the remaining portion of the implanted region to provide an oxidized region that laterally extends under the FinFET body a distance that comprises at least a majority of a width of the FinFET body, wherein the width comprises a distance from the first sidewall to the opposite second sidewall of the FinFET body.
地址 KR