发明名称 Liquid ejecting head manufacturing method and liquid ejecting head
摘要 Precise positioning of a film used to seal an electrical connection on a liquid ejecting head is made possible. Specifically, positioning is conducted in a state in which part of the film is held to a finger by suction. Next, the finger is moved downward while in the positioned state, and part of the film is pressed against a wiring board. With part of the film fixed to the wiring board in this way, a sealing resin flows while being covered by the film. Consequently, shifting of the position of the film as the sealing resin flows may be prevented. As a result, it becomes possible to conduct covering with the film in a precisely positioned state.
申请公布号 US9254661(B2) 申请公布日期 2016.02.09
申请号 US201514604957 申请日期 2015.01.26
申请人 Canon Kabushiki Kaisha 发明人 Otaka Shimpei;Imamura Isao;Shimoyama Hiroyuki;Takahashi Tomohiro
分类号 B41J2/16;H05K3/32;H05K3/28;H05K1/18 主分类号 B41J2/16
代理机构 Fitzpatrick, Cella, Harper & Scinto 代理人 Fitzpatrick, Cella, Harper & Scinto
主权项 1. A method of manufacturing a liquid ejecting head for ejecting a liquid, the method comprising the steps of: preparing a member that includes a printing element substrate provided with ejection openings for ejecting liquid, a wiring board provided with an electrical wiring, and an electrical connection for electrically connecting the printing element substrate and the wiring board; supplying a sealant to a region between the printing element substrate and the wiring board that includes the electrical connection; fixing a first part of a film to a part of the member with a holding member holding the film; and covering the electrical connection with the film.
地址 Tokyo JP