发明名称 |
Liquid ejecting head manufacturing method and liquid ejecting head |
摘要 |
Precise positioning of a film used to seal an electrical connection on a liquid ejecting head is made possible. Specifically, positioning is conducted in a state in which part of the film is held to a finger by suction. Next, the finger is moved downward while in the positioned state, and part of the film is pressed against a wiring board. With part of the film fixed to the wiring board in this way, a sealing resin flows while being covered by the film. Consequently, shifting of the position of the film as the sealing resin flows may be prevented. As a result, it becomes possible to conduct covering with the film in a precisely positioned state. |
申请公布号 |
US9254661(B2) |
申请公布日期 |
2016.02.09 |
申请号 |
US201514604957 |
申请日期 |
2015.01.26 |
申请人 |
Canon Kabushiki Kaisha |
发明人 |
Otaka Shimpei;Imamura Isao;Shimoyama Hiroyuki;Takahashi Tomohiro |
分类号 |
B41J2/16;H05K3/32;H05K3/28;H05K1/18 |
主分类号 |
B41J2/16 |
代理机构 |
Fitzpatrick, Cella, Harper & Scinto |
代理人 |
Fitzpatrick, Cella, Harper & Scinto |
主权项 |
1. A method of manufacturing a liquid ejecting head for ejecting a liquid, the method comprising the steps of:
preparing a member that includes a printing element substrate provided with ejection openings for ejecting liquid, a wiring board provided with an electrical wiring, and an electrical connection for electrically connecting the printing element substrate and the wiring board; supplying a sealant to a region between the printing element substrate and the wiring board that includes the electrical connection; fixing a first part of a film to a part of the member with a holding member holding the film; and covering the electrical connection with the film. |
地址 |
Tokyo JP |