发明名称 Top gate mold with particle trap
摘要 A top-gate molding system for encapsulating semiconductor devices includes a plurality of mold cavities formed between a middle plate and a bottom plate, and a runner system formed between an upper plate and the middle plate. The runner system includes a runner with a plurality of reservoirs along its length, with a gate extending from each of the reservoirs to one of the cavities. A particle trap is positioned on the bottom of the runner between a sprue and a first one of the reservoirs, to capture contaminating particles in a flow of molding compound before the particles enter any of the reservoirs. The particle trap can be, for example, a notch or a channel extending transversely across the bottom of the runner, or a dummy reservoir upstream of the first of the plurality of reservoirs.
申请公布号 US9254596(B2) 申请公布日期 2016.02.09
申请号 US201113340319 申请日期 2011.12.29
申请人 STMICROELECTRONICS PTE LTD. 发明人 Teysseyre Jerome;de los Reyes Glenn
分类号 B29C45/24;B29C45/17;B29C45/27 主分类号 B29C45/24
代理机构 Seed IP Law Group PLLC 代理人 Seed IP Law Group PLLC
主权项 1. A mold, comprising: a molding plate, including: a sprue;an initial gate positioned to supply molding compound to a molding cavity;a runner in fluid communication with the sprue and the initial gate, and configured to carry molding compound from the sprue to the initial gate; anda particle trap in a bottom surface of the runner between the sprue and the initial gate.
地址 Singapore SG