发明名称 |
Top gate mold with particle trap |
摘要 |
A top-gate molding system for encapsulating semiconductor devices includes a plurality of mold cavities formed between a middle plate and a bottom plate, and a runner system formed between an upper plate and the middle plate. The runner system includes a runner with a plurality of reservoirs along its length, with a gate extending from each of the reservoirs to one of the cavities. A particle trap is positioned on the bottom of the runner between a sprue and a first one of the reservoirs, to capture contaminating particles in a flow of molding compound before the particles enter any of the reservoirs. The particle trap can be, for example, a notch or a channel extending transversely across the bottom of the runner, or a dummy reservoir upstream of the first of the plurality of reservoirs. |
申请公布号 |
US9254596(B2) |
申请公布日期 |
2016.02.09 |
申请号 |
US201113340319 |
申请日期 |
2011.12.29 |
申请人 |
STMICROELECTRONICS PTE LTD. |
发明人 |
Teysseyre Jerome;de los Reyes Glenn |
分类号 |
B29C45/24;B29C45/17;B29C45/27 |
主分类号 |
B29C45/24 |
代理机构 |
Seed IP Law Group PLLC |
代理人 |
Seed IP Law Group PLLC |
主权项 |
1. A mold, comprising:
a molding plate, including:
a sprue;an initial gate positioned to supply molding compound to a molding cavity;a runner in fluid communication with the sprue and the initial gate, and configured to carry molding compound from the sprue to the initial gate; anda particle trap in a bottom surface of the runner between the sprue and the initial gate. |
地址 |
Singapore SG |