Method for embedding a chipset having an intermediary interposer in high density electronic modules

摘要

A method for creating a high density electronic module including the steps of coupling a die to an interposer for form a chipset, mounting the chipset to a substrate, coupling a wafer to the substrate so that the chipset is within a window formed in the wafer, filling the window with encapsulant to encapsulate the chipset, removing the substrate to create a reconstructed wafer, and providing an interconnection structure on the interposer to form the high density electronic module.

主权项

1. A high density electronic module component comprising:
a chipset including a die coupled to an interposer, the chipset, the die and the interposer together having a first thickness; a wafer defining a window surrounding the chipset, the wafer having a second thickness defined by a top surface and a bottom surface of the wafer, the window extending depthwise from the top surface to the bottom surface of the wafer, wherein the first thickness does not exceed the second thickness; and encapsulant filling the window around the chipset, wherein at least a portion of the interposer is exposed.