Thermal interface material on package

摘要

A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

主权项

1. A method, comprising:
removing organic compounds from a laminate and chip; dispensing a thermal interface material (TIM) on the chip; applying an adhesive around a periphery of the laminate; removing volatile species from the TIM; placing a lid on the laminate, in contact with the adhesive and the TIM; pressing the lid onto the adhesive and the TIM, at a predetermined pressing force to form a packaged assembly; and curing the packaged assembly, wherein the removal of the volatile species comprises subjecting the TIM to a vacuum outgassing process.