Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device

摘要

A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.

主权项

1. A lead frame comprising:
a die pad on which a semiconductor element is to be mounted; and a plurality of lead portions provided on a periphery of the die pad, the plurality of lead portions each including an internal terminal and an external terminal, wherein the external terminal of the plurality of lead portions is arranged in an alternately staggered form such that the external terminal of a pair of lead portions adjacent to each other is alternatively located on an inside or an outside, wherein the plurality of lead portions each having an inside region located on an inside of the external terminal, an outside region located on an outside of the external terminal, and an external terminal region having the external terminal formed on a rear surface of the external terminal region, wherein the inside region and the outside region of the lead portion, bearing at least the external terminal on the inside, each having a rear surface formed in such a manner that the inside region and the outside region are thinner than the external terminal region, and wherein a maximum thickness of the outside region of the lead portion with the external terminal located on the inside is larger than a maximum thickness of the inside region of the lead portion with the external terminal located on the inside.