发明名称 Mold clamping device
摘要 The mold clamping device is provided with a first platen to which a stationary mold is attached. A movable mold unit is capable of approaching and moving away from the stationary mold. A second platen is linked to the first platen via a tie bar. When the movable mold unit and the stationary mold are closed, a wedge member is driven onto the movable mold unit to generate mold clamping force. The second platen has a pressure receiving surface. The pressure receiving surface receives, through the wedge member, mold opening force that is generated by filling, with a molding material, the stationary mold and the movable mold unit that are in the closed state.
申请公布号 US9254522(B2) 申请公布日期 2016.02.09
申请号 US201214127347 申请日期 2012.06.21
申请人 KABUSHIKI KAISHA TOYOTA JIDOSHOKKI 发明人 Yamaguchi Kazuyuki;Funahashi Kazuki;Haguro Nobuyuki
分类号 B22D17/26;B29C45/66;B29C33/20 主分类号 B22D17/26
代理机构 Greenblum & Bernstein, P.L.C. 代理人 Greenblum & Bernstein, P.L.C.
主权项 1. A mold clamping device comprising: a first platen to which a stationary mold is attached; a movable mold, wherein the movable mold and the stationary mold are closed to form a cavity; a movable mold holding portion that is structured and arranged so as to be moved toward and away from the stationary mold together with the movable mold by a mold moving mechanism; a second platen linked to the first platen via a tie bar; and a wedge member that is structured and arranged to be driven onto a back of the movable mold holding portion to generate mold clamping force when the movable mold and the stationary mold are closed, wherein the second platen has a pressure receiving surface structured and arranged to receive through the wedge member, a mold opening force generated by filling the stationary mold and the movable mold that are in the closed state with a molding material.
地址 Aichi-ken JP