发明名称 成膜装置
摘要 An apparatus for forming a film having high uniformity in its film thickness distribution is provided. An evaporation source (212) is used in which an evaporation cell (211), or a plurality of evaporation cells, having a longitudinal direction is formed, and by moving the evaporation source in a direction perpendicular to the longitudinal direction of the evaporation source, a thin film is deposited on a substrate (203). By making the evaporation source longer, the uniformity of the film thickness distribution in the longitudinal direction is increased. The evaporation source is moved, film formation is performed over the entire substrate, and therefore the uniformity of the film thickness distribution over the entire substrate can be increased. <IMAGE>
申请公布号 JP5856110(B2) 申请公布日期 2016.02.09
申请号 JP20130156330 申请日期 2013.07.29
申请人 株式会社半導体エネルギー研究所 发明人 山崎 舜平;福永 健司
分类号 C23C14/24;H05B33/10;C23C14/00;C23C14/04;C23C14/12;C23C14/56;G09F9/00;H01L21/20;H01L21/203;H01L51/00;H01L51/50;H05B33/14 主分类号 C23C14/24
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