| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition, in which a margin for a preliminary drying time and a shelf time after preliminary drying can be ensured for a long period of time without impairing hardness of a coating film and solder heat resistance, and sticking to a negative film after exposure can be prevented. <P>SOLUTION: The photosensitive resin composition comprises (A) a carboxyl group-containing photosensitive resin, (B) a crystalline epoxy compound having a melting point of 130°C or higher and 150°C or lower, (C) a solvent, (D) a photopolymerization initiator and (E) a reactive diluent. <P>COPYRIGHT: (C)2013,JPO&INPIT |
