Selective clamping of electronics card to coolant-cooled structure

摘要

Methods of fabricating cooling apparatuses are provided which include: providing a thermal transfer structure configured to couple to an electronics card, the thermal transfer structure including a clamping structure movable between opened and clamped positions; and providing a coolant-cooled structure configured to reside within, and be associated with a receiving slot of, an electronic system within which the electronics card operatively inserts, the coolant-cooled structure residing between the electronics card and, at least partially, the clamping structure when the transfer structure is coupled to the electronics card and the card is operatively inserted into the receiving slot, wherein the opened position facilitates insertion of the electronics card into the electronic system, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the electronics card to the coolant-cooled structure.

主权项

1. A method of fabricating a cooling apparatus, the method comprising:
providing a thermal transfer structure to couple to an electronics card and facilitate transfer of heat from the electronics card, the thermal transfer structure comprising:
a clamping structure movable between an opened position and a clamped position, the clamping structure comprising a lid spaced from the electronics card when the thermal transfer structure is coupled to the electronics card; andproviding a coolant-cooled structure to reside within and electronic system, and be associated with a receiving slot of the electronic system within which the electronics card is to be operatively inserted, the coolant-cooled structure extending into the thermal transfer structure and residing between the electronics card and the lid of the clamping structure when the thermal transfer structure is coupled to the electronics card and the electronics card is operatively inserted into the receiving slot of the electronic system, wherein the opened position of the clamping structure facilitates insertion of the electronics card into the electronic system with the coolant-cooled structure disposed between the electronics card and the lid, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure, including the lid to the coolant-cooled structure, and thermal conduction of heat from the electronics card to the coolant-cooled structure.