发明名称 |
FinFETs with different fin height and EPI height setting |
摘要 |
An integrated circuit structure includes a first semiconductor strip, first isolation regions on opposite sides of the first semiconductor strip, and a first epitaxy strip overlapping the first semiconductor strip. A top portion of the first epitaxy strip is over a first top surface of the first isolation regions. The structure further includes a second semiconductor strip, wherein the first and the second semiconductor strips are formed of the same semiconductor material. Second isolation regions are on opposite sides of the second semiconductor strip. A second epitaxy strip overlaps the second semiconductor strip. A top portion of the second epitaxy strip is over a second top surface of the second isolation regions. The first epitaxy strip and the second epitaxy strip are formed of different semiconductor materials. A bottom surface of the first epitaxy strip is lower than a bottom surface of the second epitaxy strip. |
申请公布号 |
US9257344(B2) |
申请公布日期 |
2016.02.09 |
申请号 |
US201514752316 |
申请日期 |
2015.06.26 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chiang Hung-Li;Lai Wei-Jen;Yuan Feng;Lee Tsung-Lin;Yeh Chih Chieh |
分类号 |
H01L21/3205;H01L21/8234;H01L21/762;H01L21/311;H01L21/302 |
主分类号 |
H01L21/3205 |
代理机构 |
Slater & Matsil, L.L.P. |
代理人 |
Slater & Matsil, L.L.P. |
主权项 |
1. A method comprising:
forming a first and a second plurality of shallow trench isolation (STI) regions in a semiconductor substrate, wherein a first portion of the semiconductor substrate between the first plurality of STI regions is configured as a first semiconductor strip, and a second portion of the semiconductor substrate between the second plurality of STI regions is configured as a second semiconductor strip; recessing the first semiconductor strip to form a first recess having a first depth; performing a first epitaxy to grow a first epitaxy strip in the first recess; recessing the second semiconductor strip to form a second recess having a second depth different from the first depth; performing a second epitaxy to grow a second epitaxy strip in the second recess; and recessing the first plurality of STI regions and the second plurality of STI regions to form a first semiconductor fin and a second semiconductor fin, respectively, wherein the first semiconductor fin comprises a top portion of the first epitaxy strip, and the second semiconductor fin comprises a top portion of the second epitaxy strip. |
地址 |
Hsin-Chu TW |