发明名称 Semiconductor device and measurement device having an oscillator
摘要 A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.
申请公布号 US9257377(B2) 申请公布日期 2016.02.09
申请号 US201414552510 申请日期 2014.11.25
申请人 LAPIS SEMICONDUCTOR CO., LTD. 发明人 Sone Toshihisa;Yamada Kazuya;Takei Akihiro;Yoshida Yuichi;Takemasa Kengo
分类号 H01L23/495;H01L23/48;H01L23/52;H01L29/40;H01L23/00;H01L25/18;H01L23/31;H01L21/56 主分类号 H01L23/495
代理机构 Rabin & Berdo, P.C. 代理人 Rabin & Berdo, P.C.
主权项 1. A semiconductor device comprising: an oscillator including a plurality of first terminals that are disposed on a first face of the oscillator; an integrated circuit including a first region formed with a plurality of first electrode pads along one side on a first face of the integrated circuit, and a second region formed with a plurality of second electrode pads on the first face of the integrated circuit; a lead frame that includes a plurality of second terminals, and on which the oscillator and the integrated circuit are mounted such that the first terminals are sandwiched between the first electrode pads and the second terminals; a first bonding wire that connects one of the plurality of first terminals to one of the plurality of first electrode pads; and a second bonding wire that connects one of the plurality of second terminals of the lead frame to one of the plurality of second electrode pads, wherein the plurality of first terminals of the oscillator are separated from each other by a specific distance along a first direction on the first face of the oscillator, wherein a width of the first region in the first direction is narrower than the specific distance between the plurality of first terminals.
地址 Yokohama JP