发明名称 Foil trim approaches for foil-based metallization of solar cells
摘要 Foil trim approaches for the foil-based metallization of solar cells and the resulting solar cells are described. For example, a method involves attaching a metal foil sheet to a metallized surface of an underlying supported wafer to provide a unified pairing of the metal foil sheet and the wafer. Subsequent to attaching the metal foil sheet, a portion of the metal foil sheet is laser scribed from above to form a groove in the metal foil sheet. Subsequent to laser scribing the metal foil sheet, the unified pairing of the metal foil sheet and the wafer is rotated to provide the metal sheet below the wafer. Subsequent to the rotating, the unified pairing of the metal foil sheet and the wafer is placed on a chuck with the metal sheet below the wafer. The metal foil sheet is torn at least along the groove to trim the metal foil sheet.
申请公布号 US9257575(B1) 申请公布日期 2016.02.09
申请号 US201414490552 申请日期 2014.09.18
申请人 SunPower Corporation 发明人 Pass Thomas P.;Harley Gabriel
分类号 H01L31/02;H01L21/00;H01L31/0368;H01L31/028;H01L31/0304;H01L31/18 主分类号 H01L31/02
代理机构 Blakely Sokoloff Taylor Zafman LLP 代理人 Blakely Sokoloff Taylor Zafman LLP
主权项 1. A method of fabricating a solar cell, the method comprising: attaching a metal foil sheet to a metallized surface of an underlying supported wafer to provide a unified pairing of the metal foil sheet and the wafer; subsequent to attaching the metal foil sheet, laser scribing a portion of the metal foil sheet from above to form a groove in the metal foil sheet; subsequent to laser scribing the metal foil sheet, rotating the unified pairing of the metal foil sheet and the wafer to provide the metal sheet below the wafer; subsequent to the rotating, placing the unified pairing of the metal foil sheet and the wafer on a chuck with the metal sheet below the wafer; and tearing the metal foil sheet at least along the groove to trim the metal foil sheet and to leave remaining a metal foil piece electrically connected to the metallized surface of the wafer.
地址 San Jose CA US