Light emitting device package and method of manufacturing the same

摘要

The present invention relates to a light emitting device package and a method of manufacturing the same. There is provided a light emitting device package including a metal core; an insulating layer formed on the metal core; a metal layer formed on the insulating layer; a first cavity formed by removing parts of the metal layer and the insulating layer to expose a top surface of the metal core; and a light emitting device directly mounted on the top surface of the metal core in the first cavity and further there is provided a method of manufacturing the light emitting device package.

主权项

1. A method of manufacturing a light emitting device package comprising the steps of:
forming an insulating layer on a metal core; forming a metal layer on the insulating layer; forming a first cavity to expose a top surface of the metal core by removing parts of the metal layer and the insulating layer; forming a second cavity to expose the top surface of the metal core on a position apart from the first cavity at a predetermined distance by removing parts of the metal layer and the insulating layer; directly mounting a light emitting device on the top surface of the metal core in the first cavity; and after forming the second cavity, forming a conductive layer on the top surface of the metal core in the second cavity.