发明名称 実装用基板、及び電子デバイス
摘要 <P>PROBLEM TO BE SOLVED: To enhance connection reliability of a conductor pin of a mounting base plate and an electronic component to be mounted thereon. <P>SOLUTION: The mounting base plate has a first conductor pin, a second conductor pin and a support substrate, the support substrate is connected to one end side of the first and second conductor pins, and an electronic component can be connected electrically to the other end side of the first and second conductor pins. At least the first conductor pin has a side surface composed at least of a first side surface on the other end side, and a second side surface on the one end side, and the first and second side surfaces are connected to swell outward on the intersection P1 thereof. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5855863(B2) 申请公布日期 2016.02.09
申请号 JP20110156087 申请日期 2011.07.14
申请人 イビデン株式会社 发明人 塚田 輝代隆;小野 正治
分类号 H01L23/12;H01L23/50;H05K1/14 主分类号 H01L23/12
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