Copper foil structure having blackened ultra-thin foil and manufacturing method thereof

摘要

A copper foil structure having blackened ultra-thin copper foil of the instant disclosure includes a carrier foil, a blackened layer, a release layer, and an ultra-thin copper foil. The carrier foil includes a matte surface and a shiny surface wherein the blackened layer is disposed thereon. The release layer is disposed on the blackened layer formed with one selected from the group: copper, cobalt, nickel, and manganese while the release layer is formed with one selected from the group: molybdenum, nickel, chromium, and potassium. Successively, the ultra-thin copper foil is disposed on the release layer. Laser drilling can apply to the blackened ultra-thin copper foil on the inner layers of a high density multi-layer printed wiring board, thus eliminating the traditional blackening or browning chemical process. The blackened ultra-thin copper foil in combination with a polyimide thin (PI) or other substrate materials displays desirable appearance.

主权项

1. A method for manufacturing a copper foil structure having a blackened ultra-thin foil, comprising steps of:
providing a carrier foil having a shiny surface and a matte surface opposing the shiny surface; forming a blackened layer on the shiny surface of the carrier foil, wherein the blackened layer is made of a quaternary alloy having copper, cobalt, nickel and manganese; forming a release layer on the blackened layer, wherein the release layer is made of a material selected from the group consisting of molybdenum, nickel, chromium, potassium, and the combination thereof; and forming an ultra-thin copper foil on the release layer.