Isolation of thermal ground for multiple heat-generating devices on a substrate

摘要

Embodiments of a mechanism of thermal isolation for multiple heat-generating devices on a substrate are described. In one aspect, a substrate is configured for a plurality of heat-generating devices to be disposed thereon. The substrate comprises an electrically-conductive layer that is electrically coupled to the heat-generating devices when the heat-generating devices are disposed on the substrate. The electrically-conductive layer is configured to thermally isolate the heat-generating devices such that there is no thermal coupling through the electrically-conductive layer amongst the heat-generating devices.

主权项

1. A device, comprising:
a substrate configured for a plurality of heat-generating devices to be disposed thereon, the substrate comprising an electrically-conductive layer that is electrically coupled to the heat-generating devices when the heat-generating devices are disposed on the substrate, the electrically-conductive layer configured to thermally isolate the heat-generating devices such that there is no thermal coupling through the electrically-conductive layer amongst the heat-generating devices, wherein the electrically-conductive layer comprises a plurality of electrically-conductive sheets physically separated from each other, each of the electrically-conductive sheets corresponding to a respective one of the heat-generating devices.