Slider assembly and method of manufacturing same

摘要

A substrate assembly includes a chip coupled with a carrier, a substrate having a first surface and an opposing second surface, and a support structure mounted to the second surface of the substrate and in contact with the carrier. A method of bonding a chip and carrier assembly to a substrate includes contacting the chip and carrier assembly with the bond material and applying heat and force on the chip and carrier assembly until the support structure is mounted on the second surface of the substrate and in contact with the carrier. A substrate assembly includes a chip coupled with a carrier, a substrate having a first surface and an opposing second surface, and one of the carrier or the substrate comprising a trench having a periphery, wherein the second surface of the substrate supports the carrier along the periphery of the trench.

主权项

1. A substrate assembly, comprising:
a substrate having a first surface and an opposing second surface; a chip coupled with a carrier, the carrier comprising a third surface facing the second surface of the substrate; and a support structure mounted to the second surface of the substrate and in contact with the third surface of the carrier.