| 发明名称 | Condenser microphone and manufacturing method thereof | ||
| 摘要 | A condenser microphone comprises a substrate, a vibratile diaphragm and a back plate. The substrate has an opening. The diaphragm is disposed corresponding to the substrate and covers the opening, and has a plurality of protrusions. The back plate is coupled to the diaphragm and has a plurality of through holes, at least some of which are corresponding to the protrusions respectively. An interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes. | ||
| 申请公布号 | US9258662(B2) | 申请公布日期 | 2016.02.09 |
| 申请号 | US201414182820 | 申请日期 | 2014.02.18 |
| 申请人 | NATIONAL TSING HUA UNIVERSITY | 发明人 | Chen Sun-Zen;Chen Henry J. H;Chen Jen-Yi;Chiu Kuan-Hsun;Hsieh Kuang-Chien |
| 分类号 | H04R25/00;H04R31/00;H04R7/04;H04R19/04 | 主分类号 | H04R25/00 |
| 代理机构 | Muncy, Geissler, Olds & Lowe, P.C. | 代理人 | Muncy, Geissler, Olds & Lowe, P.C. |
| 主权项 | 1. A condenser microphone, comprising: a substrate having an opening; a back plate having a plurality of through holes; and a diaphragm disposed between the back plate and the substrate, wherein the diaphragm is coupled to the back plate, covers the opening and has a plurality of protrusions; and wherein at least some of the through holes are corresponding to the protrusions respectively, wherein an interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes, wherein, when the protrusions move into the through holes, the protrusions and the diaphragm do not contact with the back plate. | ||
| 地址 | Hsinchu TW | ||