| 发明名称 | Removing material from defective opening in glass mold | ||
| 摘要 | Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening. | ||
| 申请公布号 | US9254533(B2) | 申请公布日期 | 2016.02.09 |
| 申请号 | US201213491093 | 申请日期 | 2012.06.07 |
| 申请人 | GlobalFoundries, Inc. | 发明人 | Cohen Jerome D.;Haas Robert G.;Herz Enrico;Teich Michael;Tessler Christopher L. |
| 分类号 | B23K1/018;B23K1/005;H05K3/34;B23K26/40 | 主分类号 | B23K1/018 |
| 代理机构 | Hoffman Warnick LLC | 代理人 | Canale Anthony J.;Hoffman Warnick LLC |
| 主权项 | 1. A method comprising: providing a glass mold including a plurality of solder filled openings, wherein the plurality of solder filled openings includes greater than one million openings; identifying a defective opening in the glass mold; ejecting material from the defective opening by applying a laser pulse, with an output wavelength of approximately 308 nm, to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder. | ||
| 地址 | Grand Cayman KY | ||