发明名称 Capacitive electromechanical transducer
摘要 A capacitive electromechanical transducer in which a reception characteristic is hardly affected by an elastic wave intruding into a substrate is provided. The capacitive electromechanical transducer includes a first electric connection portion that is connected to a second electrode disposed on a surface of a substrate to draw the second electrode onto a side of a surface of the first substrate on a side opposite from a surface in which a first electrode and the second electrodes are provided. With respect to a thickness direction of a first substrate, a diaphragm with which the first electric connection portion is covered is formed on the side of the surface of the first substrate, in which the first and second electrodes are provided.
申请公布号 US9258650(B2) 申请公布日期 2016.02.09
申请号 US201113271168 申请日期 2011.10.11
申请人 CANON KABUSHIKI KAISHA 发明人 Kandori Atsushi
分类号 H02N1/00;H04R19/00;B06B1/02;B81B3/00 主分类号 H02N1/00
代理机构 Fitzpatrick, Cella, Harper & Scinto 代理人 Fitzpatrick, Cella, Harper & Scinto
主权项 1. A capacitive electromechanical transducer comprising: a first substrate; a first diaphragm configured to oscillate by receiving an ultrasound; a first electrode on the first diaphragm; a second electrode that is disposed on a first surface side of the first substrate, wherein the ultrasound is detected based on a change of capacitance between the first electrode and the second electrode; a through line that is electrically connected to the second electrode and penetrates the first substrate; and a first electric connection portion that is provided on a second surface side of the first substrate, the first and second surfaces being opposite surfaces of the first substrate, and electrically connected to the through line, wherein the first diaphragm is provided so as to interpose a cavity between the first diaphragm and the second electrode, and wherein the first diaphragm covers the through line and the first electric connection portion with respect to a thickness direction of the first substrate so as to reduce the ultrasound traveling to the through line and the first electric connection portion.
地址 Tokyo JP