发明名称 |
Power semiconductor device with resistance control structure |
摘要 |
A power semiconductor device includes a resistance control structure disposed in a central portion of a semiconductor substrate having a resistance to a current higher than in a peripheral portion of the substrate surrounding the central portion. The semiconductor includes a first semiconductor layer of a first conductivity type which extends laterally to run across the central portion and the peripheral portion, and a second semiconductor layer of a second conductivity type which faces the first semiconductor layer in a thickness direction and extends laterally to run across the central portion and the peripheral portion. A lifetime control layer is provided in the first semiconductor layer, extends laterally to run across the central portion and the peripheral portion and has a higher lifetime killer concentration in the central portion than the peripheral portion. The resistance control structure includes the lifetime control layer. |
申请公布号 |
US9257542(B2) |
申请公布日期 |
2016.02.09 |
申请号 |
US201414336774 |
申请日期 |
2014.07.21 |
申请人 |
MITSUBISHI ELECTRIC CORPORATION |
发明人 |
Hatori Kenji |
分类号 |
H01L29/76;H01L29/739;H01L29/06;H01L29/08;H01L29/36 |
主分类号 |
H01L29/76 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A power semiconductor device comprising a semiconductor substrate in which a current flows in a thickness direction of said semiconductor substrate,
wherein said semiconductor substrate includes a resistance control structure disposed in a central portion of said semiconductor substrate having a resistance to current higher than a peripheral portion laterally surrounding said central portion of said semiconductor substrate, wherein said semiconductor substrate includes: a first semiconductor layer of a first conductivity type which extends laterally to run across said central portion and said peripheral portion; a second semiconductor layer of a second conductivity type which faces said first semiconductor layer in said thickness direction and extends laterally to run across said central portion and said peripheral portion; and a lifetime control layer provided in said first semiconductor layer and facing said second semiconductor layer in said thickness direction; said lifetime control layer extends laterally to run across said central portion and said peripheral portion and has a higher lifetime killer concentration in said central portion than said peripheral portion; and said resistance control structure includes said lifetime control layer. |
地址 |
Chiyoda-ku JP |