发明名称 Power semiconductor device with resistance control structure
摘要 A power semiconductor device includes a resistance control structure disposed in a central portion of a semiconductor substrate having a resistance to a current higher than in a peripheral portion of the substrate surrounding the central portion. The semiconductor includes a first semiconductor layer of a first conductivity type which extends laterally to run across the central portion and the peripheral portion, and a second semiconductor layer of a second conductivity type which faces the first semiconductor layer in a thickness direction and extends laterally to run across the central portion and the peripheral portion. A lifetime control layer is provided in the first semiconductor layer, extends laterally to run across the central portion and the peripheral portion and has a higher lifetime killer concentration in the central portion than the peripheral portion. The resistance control structure includes the lifetime control layer.
申请公布号 US9257542(B2) 申请公布日期 2016.02.09
申请号 US201414336774 申请日期 2014.07.21
申请人 MITSUBISHI ELECTRIC CORPORATION 发明人 Hatori Kenji
分类号 H01L29/76;H01L29/739;H01L29/06;H01L29/08;H01L29/36 主分类号 H01L29/76
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A power semiconductor device comprising a semiconductor substrate in which a current flows in a thickness direction of said semiconductor substrate, wherein said semiconductor substrate includes a resistance control structure disposed in a central portion of said semiconductor substrate having a resistance to current higher than a peripheral portion laterally surrounding said central portion of said semiconductor substrate, wherein said semiconductor substrate includes: a first semiconductor layer of a first conductivity type which extends laterally to run across said central portion and said peripheral portion; a second semiconductor layer of a second conductivity type which faces said first semiconductor layer in said thickness direction and extends laterally to run across said central portion and said peripheral portion; and a lifetime control layer provided in said first semiconductor layer and facing said second semiconductor layer in said thickness direction; said lifetime control layer extends laterally to run across said central portion and said peripheral portion and has a higher lifetime killer concentration in said central portion than said peripheral portion; and said resistance control structure includes said lifetime control layer.
地址 Chiyoda-ku JP