Method of fabricating a semiconductor package with heat dissipating structure having a deformed supporting portion

摘要

A method of fabricating a semiconductor package is provided, including: providing a heat dissipating structure having a heat dissipating portion, a deformable supporting portion coupled to the heat dissipating portion, and a coupling portion coupled to the supporting portion; coupling a carrier having a semiconductor element carried thereon to the coupling portion of the heat dissipating structure to form between the carrier and the heat dissipating portion a receiving space for the semiconductor element to be received therein; and forming in the receiving space an encapsulant that encapsulates the semiconductor element. The use of the supporting portion enhances the bonding between the heat dissipating structure and a mold used for packaging, thereby preventing the heat dissipating structure from having an overflow of encapsulant onto an external surface of the heat-dissipating portion.

主权项

1. A method of fabricating a semiconductor package, comprising:
providing a heat dissipating structure having a heat dissipating portion, a deformable supporting portion coupled to the heat dissipating portion, and a coupling portion coupled to the supporting portion; attaching the coupling portion of the heat dissipating structure to a carrier having a semiconductor element disposed thereon to form a receiving space between the carrier and the heat dissipating portion for the semiconductor element to be received therein; and forming an encapsulant in the receiving space to encapsulate the semiconductor element and to deform the supporting portion, wherein the encapsulant is formed in a mold, and the mold has a mold cavity less than the heat dissipating structure in height, such that the encapsulant is free from flowing to an external surface of the heat dissipating portion.