发明名称 Liquid ejecting apparatus and head unit
摘要 A liquid ejecting apparatus includes a signal modulation section that causes an original drive signal to be pulse-modulated to generate a modulation signal, a signal amplification section that amplifies the modulation signal to generate an amplification modulation signal, a coil that smooths the amplification modulation signal to generate a drive signal, a piezoelectric element that deforms when the drive signal is applied thereto, a cavity that expands or contracts due to a deformation of the piezoelectric element, and a nozzle that communicates with the cavity and ejects a liquid in accordance with an increase/decrease of a pressure inside the cavity. A core material of the coil is made of a Mn—Zn-based ferrite.
申请公布号 US9254645(B2) 申请公布日期 2016.02.09
申请号 US201414459674 申请日期 2014.08.14
申请人 Seiko Epson Corporation 发明人 Kashimura Toru;Sugita Hiroshi
分类号 B41J29/38;H01F27/24;B41J2/045;B41J2/14;B41J2/155 主分类号 B41J29/38
代理机构 Harness, Dickey & Pierce, P.L.C. 代理人 Harness, Dickey & Pierce, P.L.C.
主权项 1. A liquid ejecting apparatus comprising: a signal modulation section that causes an original drive signal to be pulse-modulated to generate a modulation signal; a signal amplification section that amplifies the modulation signal to generate an amplification modulation signal; a coil that smooths the amplification modulation signal to generate a piezoelectric element drive signal; a piezoelectric element that deforms when the piezoelectric element drive signal is applied thereto; a cavity that expands or contracts due to a deformation of the piezoelectric element; and a nozzle that communicates with the cavity and ejects a liquid in accordance with an increase/decrease of a pressure inside the cavity, wherein a core material of the coil is made of a Mn—Zn-based ferrite, the original drive signal has a frequency range of 10 kHz-400 kHz, and a resistance component including a core material loss and a wire material loss is lower than 200 mΩ in the coil during a 4 MHz-operation.
地址 JP
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