並列光通信モジュールを回路基板にミッドプレーン実装するための方法、装置及びシステム

摘要

A socket is provided that is configured to be secured to a surface of a host circuit board by solder using a solder reflow process. The solder reflow process that is used for this purpose may be the same solder reflow process that is used to make electrical connections between the array of electrical contacts disposed on the lower surface of the socket and the array of electrical contacts disposed on the upper surface of the host CB. Because the solder reflow process is an automated process, the process of securing the socket to the surface of the host CB does not have to be performed manually, but can be performed automatically as part of a typical automated surface mount technology (SMT) process of the type that is typically used to mount components on a PCB.