| 发明名称 | Semiconductor device | ||
| 摘要 | A semiconductor device includes a base substrate on which a substrate electrode is arranged, and a semiconductor element which includes a chip electrode electrically connected via solder to the substrate electrode and in which a light absorbing layer is formed on a lower surface side. | ||
| 申请公布号 | US9257395(B2) | 申请公布日期 | 2016.02.09 |
| 申请号 | US201414306432 | 申请日期 | 2014.06.17 |
| 申请人 | SONY CORPORATION | 发明人 | Hatada Izuho;Ootorii Hiizu;Oka Shuichi;Yanagawa Shusaku |
| 分类号 | H01L23/52;H01L23/48;H01L23/552 | 主分类号 | H01L23/52 |
| 代理机构 | Dentons US LLP | 代理人 | Dentons US LLP |
| 主权项 | 1. A semiconductor device comprising: a base substrate on which a substrate electrode is arranged; and a semiconductor element which includes a chip electrode at a lower surface side thereof and an under bump metal layer adjacent the chip electrode at the lower surface side, the under bump metal layer electrically connected to the chip electrode and electrically connected via solder to the substrate electrode, the under bump metal layer including a light absorbing layer and a heat diffusing layer. | ||
| 地址 | Tokyo JP | ||