Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer

摘要

A semiconductor device has a plurality of conductive vias formed into a semiconductor wafer. An insulating lining is formed around the conductive vias and a conductive layer is formed over the insulating lining. A portion of the semiconductor wafer is removed so the conductive vias extend above a surface of the semiconductor wafer. A first insulating layer is formed over the surface of the semiconductor wafer and conductive vias. A first portion of the first insulating layer is removed and a second portion of the first insulating layer remains as guard rings around the conductive vias. A conductive layer is formed over the conductive vias. A second insulating layer is formed over the surface of the semiconductor wafer, guard rings, and conductive vias. A portion of the second insulating layer is removed to expose the conductive vias and a portion of the guard rings.

主权项

1. A method of making a semiconductor device, comprising:
providing a semiconductor die; forming a conductive via through the semiconductor die with a portion of the conductive via extending above a first surface of the semiconductor die; and forming a guard ring overlaying the first surface of the semiconductor die within a height of the conductive via.